May 8, 202500:17:31

Abstracts: Heat Transfer and Deep Learning with Hongxia Hao and Bing Lv

Silicon has long borne the burden of heat transfer in electronics, but in a post-Moore’s Law world, researchers like Hongxia Hao and Bing Lv are using AI to discover and design next-generation materials that exceed the limits of silicon’s thermal conductivity.

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